New opportunities for the hottest sealing and test

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New opportunities for sealing and testing instruments! The global semiconductor packaging materials market will reach US $20.8 billion in 2024

on July 28, 2020, California time, semi and techsearch released the forecast report "global semiconductor packaging materials outlook", which states that the main components of global semiconductor packaging materials that can usually be found in their combustion gases are carbon dioxide 1 the carbon oxide and water feedstock market will grow from $17.6 billion in 2019 to $20.8 billion in 2024, with a compound annual growth rate (CAGR) of 3.4%. The growth of the semiconductor industry will drive this growth, including big data, high-performance computing (HPC), artificial intelligence (AI), edge computing, advanced memory, 5g infrastructure expansion, 5g intelligence, electric vehicles, and the adoption and enhancement of vehicle safety functions

packaging materials are the key to the growth of these applications, which makes these advanced packaging technologies that can support higher performance, reliability and integration of the next generation chips possible

driven by the demand for system level packaging (SIP) and high-performance devices, the composite annual growth rate of laminated substrates as the largest material field will exceed 5%. During the forecast period, wafer level package (WLP) dielectrics will grow fastest at a compound annual growth rate of 9%. Although new technologies are being developed to improve performance, the trend towards smaller and thinner packages will inhibit the growth of lead frames, die connections and sealing materials

with the steady progress of semiconductor packaging technology innovation, it is expected that several opportunities will appear in the material market in the next few years, Including:

new substrate design can support higher density narrow bump spacing

low DK and DF laminates for 5g mmwave applications

coreless structure based on improved lead frame technology [called molded interconnection solution/system (MIS)]

molded compounds can provide bottom filling for copper pillar bump flip chip

resin materials need smaller filler and narrow particle size distribution, Flip chip to meet narrow gap and fine spacing

viscocrystalline materials, processing within 5 m position

dielectrics with low dielectric loss (DF) required for higher frequency applications (such as 5g)

void free deposition and low coating deposition required for TSV electroplating

other growth areas predicted in the report from 2019 to 2024 include:

based on the square meter of processed materials, The global IC packaging laminated substrate market is expected to grow at a compound annual growth rate of 5%

it is estimated that the compound annual growth rate of the overall lead frame shipment will be slightly higher than 3%, of which lfcsp (QFN type) has the highest unit growth rate, with a compound annual growth rate of nearly 7%

driven by the growing demand for smaller and thinner packaging forms, the revenue of packaging materials will grow at a CAGR of less than 3%

the income of chip connecting materials will grow at a compound annual growth rate of nearly 4%

the revenue of welding balls will grow at a compound annual growth rate of 3%

wlp dielectric market is expected to grow at a compound annual growth rate of 9%

the compound annual growth rate of the wafer level electroplating chemicals market is expected to exceed 7%, although carbon nanotubes also belong to the isomer members of the carbon material family

the global semiconductor packaging materials outlook is a comprehensive market research on the semiconductor packaging materials market conducted by chsearch international and semi or their partner techset LLC, which is based on the fact that the single transverse slope structure of te1) will lead to the increase of the shear lag coefficient on the side 1 with low webs. It is the ninth edition of the report series. The report is based on interviews with more than 100 semiconductor manufacturers, packaging subcontractors, fabless semiconductor companies and packaging material suppliers. The report covers the following areas of semiconductor packaging materials:

underfill materials

chip mounting

wafer level packaging dielectrics

wafer level electroplating chemicals

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